PicoTech offers a full range of Cutting Edge tools for Dicing, Grinding and Polishing.
We proudly support the largest installed base of Dicing and Grinding tools in Israel, both in the Academy and Production sites.
Blade Dicing
Introducing various processing technologies to further improve quality and productivity with the current blade dicing, such as thin silicon dicing and measures to prevent contamination of the processing surface.
Ultra Thin Grinding
Introducing various grinding wheels and handling mechanisms to support the increase in demand for less than 100 µm thin grinding, and newly developed wafer grinding technologies
…Si, Glass, Ceramic, Compounds, Plastics etc..Grinding Wheels,Blades, Dicing Tapes..
