Plasma Etching or Dry Etching is a plasma based process that facilitates the removal of material from the surface of a substrate. In most cases, plasma processing of semiconductor materials is performed in a vacuum environment. The goal of dry etching is generation of reactive species inside the plasma which reacts with the substrate with the formation of forming volatile reaction byproducts.
In case of IBD the technique is conceptually similar to Sandblasting, where the individual atoms in the Ion Beam are used to mill the substrate material.
With the largest installed base in Israel PicoTech provides tools for all following Dry Etch technologies:
