PicoTech offers a full range of Automatic Multi-Purpose and Sub-Micron Die Bonding tools for various R&D applications, including Semiconductors, PCB, General Electronics.
Automatic Multi-Purpose and Sub-Micron Die Bonding tools work with placement accuracy down to 0.3 µm. Quick to set up and easy to operate, these systems are ideal for fast and flexible product development and prototyping in R&D labs and universities.
Typical applications are:
Numerous bonding and flip-chip technologies: Adhesive, Soldering, Thermocompression, Ultrasonic, Reflow Soldering.
Applications:
• Generic MEMS assembly
• Gas pressure sensor assembly
• High-power laser module assembly
• Micro-optical bench assembly
• Ultrasonic transceiver assembly
• IR detector assembly
• Laser diode assembly
• Visual image sensor assembly
• Acceleration sensor assembly
• VCSEL/photo diode (array) assembly
• Mechanical assembly
• X-ray detector assembly
• Laser diode bar assembly
• Generic MOEMS assembly
• Single photon detector assembly
• Optical sub assembly (TOSA/ROSA)
• Micro optics assembly
• Lens (array) assembly
• Ink jet print head assembly
• E-beam module assembly
• Adhesive bonding
• Thermocompression bonding
• Soldering / eutectic soldering
• Thermo- / ultrasonic bonding
• Sintering
• Active alignment
• Laser-assisted bonding
• Precision vacuum die bonding
• Chip on Flex/Film (CoF)
• Chip on Flex/Film (CoF)
• Chip on Glass (CoG)
• Multi chip packaging (MCM, MCP)
• Flip chip bonding (face down)
• 2.5D and 3D IC packaging (stacking)
• Wafer level packaging (FOWLP, W2W, C2W)
• Precision die bonding (face up)
• Flex on board
• Chip on board (CoB)
