Bond Testers for 2″-12″ Wafers

PicoTech offers Bond Testers for 2″-12″ Wafers by XYZtec.

Versatile wafer level bond testers allow to perform all major TEST TYPES in the electronics industry, including: Wire Pull, Shear, Cold Bump Pull, Tweezer Pull and many others.

Information about different test types and technologies can be found in the KNOWLEDGE CENTER.

Fully automatic Wafer Bondtesters can support wafers with sizes 2” – 12” (up to 300 mm) and perform tests with Force Range from 1 gf – 10 kgf. Supported Bump Pitch is 50 or 20um depending on the model.