PicoTech offers Plasma Decapsulation Systems for Failure Analysis by Corial.
IC Failure Analysis
The preparation of ICs for failure analysis, yield enhancement, or reverse engineering requires such techniques as sample deprocessing, and backside silicon access. These techniques can be performed with a plasma etch tool.
The quest for more powerful, smaller, and faster devices increases the need for more metal layers during the chip design and manufacturing processes.
Deprocessing is a challenging effort, as the device must retain electrical integrity, and its surface must remain planar for further investigation on the root causes of the failure.
Semiconductor failure analysis requires techniques to remove the upper layers and intermetal dielectrics of diverse ICs, to expose a defect area that may be located beneath those layers.
From single or multilevel deprocessing without erosion of metallization layers for maintaining electrical investigation, to the most selective and damage free processes for metal etching, CORIAL RIE and ICP-RIE FA solutions enable sample preparation of dies, packaged dies and wafers up to 200 mm.
