Alignment for Bonding Process (Bond Aligners)

PicoTech offers a wide range of Alignment tools for Bonding Process by Suss MicroTec for R&D applications.

 

Precise alignment for all bond processes

The bond aligners are designed for manual alignment and subsequent bonding of substrates up to 200 mm in size. Further functionality becomes available after the optional addition of mask aligner tooling.

 

Typical applications are:

Advanced Packaging, MEMS production, Sub-Micron Precise Alignment.