Semi-Automatic Laser and Mechanical Wafer Debonding

PicoTech offers a wide range of Semi-Automatic Laser and Mechanical Wafer Debonding tools by Suss MicroTec for R&D applications.

Laser-based wafer processing is based on the application of an excimer laser which uses nanosecond, high energy 308 nm laser pulses to break the chemical bonds in a release layer or the actual adhesive which holds the glass carrier to the device wafer. This excimer laser-based debonding process does not produce significant thermal stress and therefore ensures the integrity of sensitive components.

Laser debonding tools are designed to debond glass carriers from full thickness wafers or thinned 200 mm and 300mm wafers which are mounted on tape frames

Typical applications are: 2.5D and 3D integration, 3D MEMS and CIS, Power Devices.

Mechanical Peel-off processing represents the state-of-the-art solution for mechanical peel-off debonding at room temperature for a large variety of thin wafer handling applications. Tooling options for wafer sizes ranging from 4″ to 12″ and different carrier materials such as glass or silicon are available.

Typical applications are: Power Devices, 2.5D interposers and 3D integrated devices, 3D wafer level packaged MEMS, Fan-out wafer-level packages and others.