PicoTech offers Fast Atomic Sequential Technology (F.A.S.T.) PECVD Tools by Plasma-Therm for High Volume Production and R&D.
When thick and conformal films matter, fast atomic sequential technology (F.A.S.T.) is the solution. Based on Plasma-Therm’s proprietary chemical vapor deposition (CVD) reactor design combined with pulsed capability, F.A.S.T. offers new solutions for 3D integration challenges and other aggressive aspect ratio applications. F.A.S.T. delivers film conformality superior to plasma-enhanced CVD (PECVD) at deposition rates greater than that of atomic layer deposition (ALD).
Typical applications are:
- Advanced packaging (through-silicon vias), superconducting films (TiN)
- Oxides, nitrides, metals, metal oxides
- Liners, barriers, seed layers
