PicoTech offers a wide range of Fully Automatic and Cluster Tools for PECVD and HDPECVD for High Volume Production and R&D. These Deposition tools are suitable for wafer processing from pieces up to 300mm with automatic substrate loading.
Technologies are: Plasma Enhanced Chemical Vapor Deposition (PECVD) and High-Density Plasma Enhanced Chemical Vapor Deposition (HDPECVD).
Modular design of Cluster Tools allows flexible configuration of substrate handling for a variety of handling options, from R&D single wafer or carrier loading with a load lock to high-volume, multi-chamber production clusters. Clear upgrade paths that leverage costs and process development make future planning easy.
Typical applications are:
Large library of processes for Wireless, Photonics, Power Device, Compound Semiconductor, Memory, Quantum, and Advanced Packaging applications:
• Silane-based films: a-Si, SiO2, SiNx, SiON, SiC, SiOF, a-SiC
• TEOS films
• Stress control
• High and low deposition rates
• Tunable refractive index
For HDPECVD:
• Silane-based films: a-Si, SiO2, SiNx, SiON, SiC, SiOF
• <180C deposition conditions
• Trench/gap fill
• High-density, low-BOE films
• TEOS and DLC (diamond-like carbon)
