PicoTech offers Compact Table-Top Diffusion Furnaces by SVCS.
The SVCS Tabletop Furnace system provides a semiconductor-grade quality tool for universities, R&D laboratories and pilot fabs. This system can be used for wide range of processes due to outstanding flexibility and ammount of optional modules available to meet special and often unique requirements of every customer.
SVCS Tabletop Furnace system can accommodate wafer sizes 2″ – 6″ (50 mm – 150 mm) with wafer load up to 25 wafers per batch. 1 or 3 heating zones with flat zone of 12″ (300 mm) provides process temperature up to 1300 oC with ± 0.5 oC uniformity across flat zone
Typical applications are:
Atmospheric Processes
- Diffusion (drive-in) high-temperature processes
- Doping from solid, liquid and gaseous dopant sources e.g.: BBr3, B2H6, POCL3, PH3, BN
- Various thermal processing: Annealing, Sintering
- Pyrogenic Wet Oxide with External Burning System
- Wet Oxide with ultra-pure steamer
- Dry Oxide
- HiPOx (High Pressure Oxide)
LPCVD Processes
- Silicon nitride
- Low-temperature oxide (LTO)
- High-temperature oxide (HTO)
- TEOS oxide
- Polysilicon, with tilt/flat temperature profile
- Doped polysilicon
- Oxynitride
PECVD Processes
- Silicon nitride (incl. anti-reflective SiN solar cell coating)
- Silicon oxide
- Oxinitride
DCE or HCl optional for all processes
