PicoTech offers Silver Sintering Technology tools by Boschman for Advanced Packaging.
Ag-Sintering Technology
Silver sintering is a proven die attach technology offering a void-free and strong bond with high thermal and electrical conductivity. It provides both high yield and high reliability. It can decrease the junction temperature (Tj) of your device up-to 100℃. In the Sinter process, being heated under the right circumstances in terms of pressure, temperature and time, the silver material changes in form from powder to a solid structure. This results in a reliable sinter bond which increases both the performance and lifetime of your device, compared to traditional solder material.
Main advantages of Ag-Sintering technology:
• Closed loop precise pressure control and monitoring.
• Pressure applied only on areas where required.
• Guaranteed equal pressure for multi Die applications due to the patented , Silicone-free, Dynamic Insert Technology (DIT).
• Extremely long life-time of tooling resulting in very low running costs.
• Enabling highest density tools with interspaces down to 400µm.
• Largest available effective sinter area of 350x270mm, providing a high UPH.
• Supporting large variation of geometries, including clips.
Typical applications are:
Ag sintering systems offer the absolute highest throughput available in the market. Systems are capable of sintering a wide range of different devices: among others LEDs, Power Devices Clip/heatsinks assemblies, solar (CVP) cells, custom designed power modules and more.
