PicoTech offers a full range of equipment in the field of Back-End and Advanced Packaging for the Semiconductor, PCB, General Electronics, R&D and other industries. The portfolio of machines includes manual, semi-automatic and fully automatic tools for R&D and Production purposes. Machines can accommodate samples from small pieces up to 300mm wafers as well as panels.

The list of technologies includes:

Wafer Dicing, Wafer Grinding, Dicing Before Grinding (DBG), Stealth Dicing, Wafer Laser Dicing, Wafer Thinning, Wafer Polishing, Chemical Mechanical Polishing (CMP), Post-CMP Cleaning, Die Attach and Die Bonding, Flip-Chip Bonding, Wire Bonding, Pull and Shear Testing, Advanced Packaging with Sintering, Molding and other technologies.

Dicing, Grinding and Polishing of Glass, Sapphire, Ceramic, Metal and other materials used in R&D and Manufacturing. Laser Dicing and Cutting of different materials using different Laser Dicing Technologies.