PicoTech offers a full range of Atomic Layer Deposition (ALD) tools starting from simple R&D tools and up to full scale production systems.

Both Thermal (TALD) and Plasma Enhanced Atomic Layer Deposition (PEALD) systems are presented, different machines can accommodate samples from small pieces up to 300mm wafers. Manual, semi-automatic and fully automated platforms are available for R&D and production purposes.

Atomic Layer Deposition systems are designed to deposit pinhole free coatings that are perfectly uniform in thickness, even deep inside pores, trenches and cavities. The ability to deposit such high-quality films on substrates with ultra-high aspect ratios is a key feature of Atomic Layer Deposition systems.

A wide variety of thin films can be deposited using gas, liquid, or solid precursors.