PicoTech offers a full range of equipment for “back-end” process steps including semiconductor wafer Dicing, Grinding, Thinning, Polishing, Chemical Mechanical Polishing (CMP), Post-CMP Wafer Cleaning.

Typical applications are:

In the semiconductors industry: Wafer Dicing, Wafer Back Grinding, Dicing Before Grinding (DBG), Stealth Laser Dicing, Materials Thinning, Materials Polishing, Chemical Mechanical Polishing (CMP), Post-CMP Wafer Cleaning. Manual and semi-auto systems can accommodate sample sizes from small pieces up to 300mm. Samples can be handled one by one or in batches.

In general R&D and Manufacturing: Mechanical Dicing, Grinding and Polishing of Glass, Sapphire, Ceramic and other materials. Laser Dicing and Cutting of different materials using different Laser Dicing Technologies.