Wire Bonding Equipment

PicoTech offers a comprehensive range of equipment for Wire Bonding in semiconductor technologies, PCB, and general electronics. Various machines are available for simple R&D applications, production purposes, and advanced semiconductor technology applications.

 

Typical applications are:

Fine Wire Bonding and Heavy Wire Bonding. Manual, semi-automatic and fully-auto systems can accommodate different wire thicknesses down to tens of microns and sample sizes from small pieces up to 300mm wafers. Samples can be handled one by one or in batches.