PicoTech offers a full range of equipment for Die Attach, Die Bonding and Flip-Chip in the area of semiconductor technologies and PCB. Many different machines can be used for simple R&D applications and for sophisticated applications in the area of challenging Flip-Chip technologies.

Typical applications are:

Die Attach, Die Bonding, Flip-Chip bonding. Manual and semi-automatic systems can accommodate the smallest chip sizes and substrate sizes from small pieces and up to 300mm and larger. Samples can be handled one by one or in batches for high-volume production.