Wafer bonding

PicoTech offers a full range of equipment for Wafer Bonding. The portfolio of machines includes manual, semi-automatic and fully automatic tools for R&D and Production purposes. Machines can accommodate samples from small pieces up to 300mm wafers for all types of bonding.

 

Typical applications are:

Wafer bonding for MEMS, Advanced Packaging, 2.5D integration and 3D integration, LED and other emerging applications. Manual machines can accommodate sample sizes from small pieces up to 200mm. Production type tools can accommodate sample sizes from 100mm up to 300mm. Samples can be handled one by one or in cassettes.