PicoTech offers a full range of plasma tools for Plasma Dry Etch and Ion Beam Etch (IBE). Plasma Dry Etch technology includes Reactive Ion Etch (RIE), Inductively Coupled Plasma Etch (ICP), Deep Silicon Etch with fast gas switching (DSE), Dry Mask Etch. Many different platforms and product families are presented in this section. A variety of plasma systems allows to cover all plasma etch related tasks on every level starting from R&D and up to a full-scale manufacturing.

Typical applications are:

All types of Dry Etch for Semiconductors and other materials, Deep Silicon Etch for MEMS and other applications, Mask Etch, Precision Ion Beam Etch, Manual and semi-automatic Plasma Systems can accommodate sample sizes from small pieces up to 300mm. Samples can be handled one by one or in batches.