PicoTech offers a full range of Automatic Sub-Micron Flip-Chip Bonding tools for various Production and R&D applications, including Semiconductors, PCB, General Electronics.
Automatic Sub-Micron Flip-Chip Bonding tools work with ± 0.3 μm post-bond accuracy. These systems are high accuracy and high force systems for Chip-to-Chip -up to 100 mm- and Chip-to-Wafer -up to 300 mm- applications with ± 0.3 µm post-bond accuracy.
Automatic Sub-Micron Flip-Chip Bonding tools cover a large range of bonding forces, from 1 to 4000 N. That makes it perfectly suitable for reflow and thermocompression processes. The leveling between both components is adjusted before each bonding within 1 μradian. The parallelism adjustment, the high resolution alignment and the perfect control of all bonding parameters allow to achieve submicronic post-bond accuracy.
Typical applications are:
- Infrared and X-Ray image sensors
- MicroLEDs displays
- Quantum computing
- 3D integration, memory stacking
- Optoelectronics
- Silicon photonics
- Chip-to-Chip
- Chip-to-Wafer
- Nanoimprinting
- Flip-Chip / Die bonding
- Thermocompression
- Reflow
- Adhesive bonding
- UV-curing bonding
- Thermosonic
