PicoTech offers a full range of Manual High-Accuracy Flip-Chip Bonding tools for various R&D applications, including Semiconductors, PCB, General Electronics.
Manual High-Accuracy Flip-Chip Bonding tools work with ± 0.5 μm post-bond accuracy. Quick to set up and easy to operate, these systems are ideal for fast and flexible product development and prototyping in R&D labs and universities. The only motorized axis is the arm, which controls precisely the bonding force. Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process.
Typical applications are:
- Flip-Chip, Die attach
- C2C, C2S
- Optoelectronics and optical components
- MEMS, MOEMS, MCM
- Laser Bars and VECSEL
- 3D Packaging
- Nanoimprinting
- Thermocompression
- Reflow
- UV Curing
- Au, Au/Sn, In, Cu
- Micro-Assembly
