PicoTech offers a full range of Manual Multi-Purpose Die Bonding tools for various R&D applications, including Semiconductors, PCB, General Electronics.
Manual Multi-Purpose Die Bonding tools work with placement accuracy down to 0.5 µm. Quick to set up and easy to operate, these systems are ideal for fast and flexible product development and prototyping in R&D labs and universities.
Typical applications are:
Numerous bonding technologies: Adhesive, Soldering, Thermocompression, Ultrasonic, Reflow Soldering.
Applications:
• X-Ray detector assembly
• IGBT assembly
• Generic MOEMS assembly
• Ultrasonic transceiver assembly
• Ink jet print head assembly
• Visual image sensor assembly
• RFID module assembly
• Generic MEMS assembly
• NFC device packaging
• RF/HF module assembly
• Acceleration sensor assembly
• Mechanical assembly
• Gas pressure sensor assembly
• Adhesive bonding
• Soldering / eutectic soldering
• Sintering
• Thermocompression bonding
• Thermo- / ultrasonic bonding
• Wafer level packaging (FOWLP, W2W, C2W)
• Glass on Glass
• Chip on Glass (CoG)
• Chip on Board (CoB)
• 2.5D and 3D IC packaging (stacking)
• Flip chip bonding (face down)
• Chip on Flex / Film (CoF)
• Flex on Board
