PicoTech offers a full range of Production Scale Die Bonding and Flip-Chip Bonding tools for various Production and R&D applications, including Semiconductors, PCB, General Electronics.
Production Scale Die Bonding and Flip-Chip Bonding tools work with sub-micron accuracy. These systems are suitable for high-precision and high-speed component assembly
Typical applications are:
Applications are found across a wide range of market segments, such as life & health sciences, aerospace, defense, automotive, lighting, communications, and more.
Some systems are ideal for advanced applications such as sintering for power semiconductors and thermocompression bonding for IC packaging.
