PicoTech offers a full range of Semi-automatic Sub-Micron Die Bonding tools for various R&D applications, including Semiconductors, PCB, General Electronics.
Semi-auto Sub-Micron Die Bonding tools work with placement accuracy down to 0.5 µm. Quick to set up and easy to operate, these systems are ideal for fast and flexible product development and prototyping in R&D labs and universities.
Typical applications are:
Numerous bonding and flip-chip technologies: Adhesive, Soldering, Thermocompression, Ultrasonic, Reflow Soldering.
Applications:
• µLED (array) assembly
• Generic MEMS assembly
• VCSEL/photo diode/-array assembly
• Micro optics assembly
• Generic MOEMS assembly
• Laser diode assembly
• Visual image sensor assembly
• Optical sub assembly (TOSA/ROSA)
• Gas pressure sensor assembly
• Laser diode bar assembly
• Micro-optical bench assembly
• Acceleration sensor assembly
• Lens (array) assembly
• Adhesive bonding
• Soldering / eutectic soldering
• Sintering
• Thermocompression bonding
• Thermo- / ultrasonic bonding
• Chip on Flex / Film (CoF)
• Flip chip bonding (face down)
• 2.5D and 3D IC packaging (stacking)
• Precision die bonding (face up)
• Chip on Glass (CoG)
