PicoTech offers a full range of Semi-automatic Sub-Micron Flip-Chip Bonding tools for various R&D applications, including Semiconductors, PCB, General Electronics.
Semi-auto Sub-Micron Flip-Chip Bonding tools work with ± 0.5 μm post-bond accuracy. Quick to set up and easy to operate, these systems are ideal for fast and flexible product development and prototyping in R&D labs and universities.
Typical applications are:
- Chip-to-Chip
- Chip-to-Wafer
- Optoelectronics
- Silicon photonics
- Focal plane arrays
- Infrared and X-Ray image sensors
- 3D integration, memory stacking
- Nanoimprinting
- Flip-Chip / Die bonding
- Thermocompression
- Thermosonic
- Reflow
- UV / Thermal curing adhesives, polymers
