Automatic High-Force Bond Testers

PicoTech offers Automatic High-Force Bond Testers by XYZtec.

Fully Automatic High-Force Bond Testers allow to perform all major TEST TYPES in the electronics industry, including: Wire Pull, Shear, Cold Bump Pull, Tweezer Pull and many others.

Information about different test types and technologies can be found in the KNOWLEDGE CENTER.

Fully Automatic High-Force Bond Testers are specially designed for high-force and large substrate area. Typically for IGBT, power modules and batteries up to 1000 kgf.