Wafer Dicing Saws

PicoTech offers a full range of Automatic and Fully-automatic Dicing Saws by DISCO Hi-Tec for various applications, including Semiconductors, PCB, General Electronics and R&D.

Automatic and Fully-automatic dicing saws with single and dual spindles can accommodate workpiece sizes from pieces and up to 300mm. Manual and cassette loading options as well as cleaning options are available.

Mechanical Dicing Saws are widely used not just in the semiconductors industry, but also in many other industries and in R&D to process, dice and cut a variety of materials: Glass, Sapphire, Ceramic Materials, Metals, PCBs, etc.