Wafer Laser Dicing

PicoTech offers a full range of Automatic and Fully-automatic Laser Dicing Saws by DISCO Hi-Tec for various applications, including Semiconductors, PCB, General Electronics.

Automatic and Fully-automatic Laser Dicing Saws can accommodate workpiece sizes from pieces and up to 300mm. Manual and cassette loading options are available. Different technologies of laser dicing are used in the machines: Laser Ablation and Stealth Dicing.

Laser Dicing Saws are widely used not just in the semiconductors industry, but also in many other industries and in R&D to process, dice and cut a variety of materials: Glass, Sapphire, Ceramic Materials, Metals, PCBs, etc.