PicoTech offers a full range of Wafer Plasma Dicing tools by Plasma-Therm for various semiconductor applications.
Plasma dicing changes the dynamics of singulating dies by avoiding the sequential cutting processing of saw blades and lasers and offering a parallel approach in which all the die are separated simultaneously. This reduces dicing cost and improves die quality.
Replacing saw blades with dry etching technology based on inductively coupled plasma reactive ion etching (ICP RIE) means that dies can be moved closer together to save valuable wafer real estate. As die get smaller, using traditional saw technology requires more streets, which takes more time and consumes more of the wafer. Additionally, sawing smaller die increases the potential for microcracks and reduces die strength. This all contributes to lower die yield per wafer.
Plasma Dicing on Tape (PDOT™)
Wafers are mounted on dicing tape using well-accepted practices and then loaded into the plasma dicing system for singulation.
Plasma Dicing on Carrier (PDOC)
In this embodiment, wafers are temporarily mounted to a carrier before being loaded into the plasma dicing system for singulation.
Plasma Dicing Before Grind (PDBG)
With PDBG technology, the streets are etched before the wafers are mounted onto the dicing tape. After etching the streets, the wafers are flipped, mounted to dicing tape and tape frame, and then thinned, either with grinding or with plasma.
