Automatic Heavy Wire Bonding

PicoTech offers a full range of Automatic Heavy Wire Bonding tools for Production and R&D applications, including Semiconductors, PCB, General Electronics.

Automatic Heavy Wire Bonding tools are ideal for single or multi-track automation. Interchangeable bondheads for fine and heavy wire are ideal for use in laboratories, in the development, for prototypes or small series.

 

Typical applications are:

Wedge-Wedge & Ball-Wedge Wire bonding, Thin and Heavy Wire, Heavy Ribbon, High-Speed Wire bonding, Deep Access Wire bonding.

Components in HF and RF technology, COB, MCM, hybrids, optical and automotive electronics.