Manual Wire Bonding for R&D

PicoTech offers a full range of Manual Wire Bonding tools for various R&D applications, including Semiconductors, PCB, General Electronics.

Manual Wire Bonding tools are quick to set up and easy to operate, these systems are ideal for fast and flexible product development and prototyping in R&D labs and universities.

 

Typical applications are:

Wedge-Wedge & Ball-Wedge Wire bonding