Semi-automatic Wire Bonding for R&D

PicoTech offers a full range of Semi-automatic Wire Bonding tools for various R&D applications, including Semiconductors, PCB, General Electronics.

Semi-auto Wire Bonding tools are quick to set up and easy to operate, these systems are ideal for fast and flexible product development and prototyping in R&D labs and universities.

 

Typical applications are:

Wedge-Wedge & Ball-Wedge Wire bonding, Thin and Heavy Wire