PicoTech offers a full range of Smart Ultrasonic Welding tools for Production and R&D applications, including Semiconductors, PCB, General Electronics.
Smart Ultrasonic Welding tools combine the best of two technologies: The force and ultrasonic power of ultrasonic welding equipment and The flexibility, precision, speed and advanced process control features of wire bonding machines.
Smart Welders can, like ultrasonic wire bonders, flexibly handle a large variety of products.
Typical applications are:
Wedge-Wedge & Ball-Wedge Wire bonding, Thin and Heavy Wire, Heavy Ribbon, High-Speed Wire bonding, Deep Access Wire bonding.
Components in HF and RF technology, COB, MCM, hybrids, optical and automotive electronics.
