PicoTech offers a wide range of Nanoimprint Solutions by Suss MicroTec for Suss MicroTec Mask Aligners.
SUSS MicroTec offers various approaches to the imprint technology, tailored to the specific process requirements of different applications. All imprint solutions are based on SUSS MicroTec’s highly regarded semi-automated mask aligner suite and support multiple substrate materials and sizes from small pieces up to 300 mm wafers.
The mask aligner platform not only allows for accurate alignment of stamp to substrate but also provides valuable functionalities such as precise stamp-to-substrate leveling and contact pressure control. Process recipes are conveniently edited, offering a high degree of adjustability for all relevant parameters.
SUSS mask aligners even in the field are easily upgraded with nanoimprint tooling. SUSS Imprint Technologies are:
SCIL – Large-Area Nano-Imprinting
SCIL (substrate conformal imprint lithography) technology is particularly suitable for high demand imprint processes. Here a soft stamp is used in combination with a hard but flexible glass carrier, thereby achieving superior evenness of contact and exceptionally high fidelity in pattern transfer.
As a result of its excellent structure replication and high uniformity, SCIL technology is suited for all highly demanding processes where a high-quality etching mask is employed, such as the production of optical elements and MEMS/NEMS as well as in the production of HB LEDs and VCELS. SCIL technology was developed in collaboration with Philips Research.
SMILE – Micro- and Nano-Imprinting
The process allows very precise exposure of both micro- and nano-patterns, thereby offering a wide spectrum of potential applications and thus excellent process flexibility. SMILE is used for example in the production of MEMS and optical lenses for wafer-level-cameras.
