Debonding and Cleaning for Production

PicoTech offers a wide range of Debonding and Cleaning tools for Production by Suss MicroTec.

Debonding and Cleaning Production tool is designed for processing wafers of 200 and 300 mm in size as well as oversized carriers. Sophisticated processing allows for handling of tape mounted device wafer as thin as 50 µm or even below.

Its advanced process versatility reaches from mechanical peel-off and excimer laser-assisted debonding to cleaning capabilities for thinned wafer and carrier wafer. Typical application is 2.5D and 3D integration.