Fully-Automatic Wafer Bonding

PicoTech offers a wide range of Fully Automatic Wafer Bonding tools by Suss MicroTec for production and R&D applications.

 

Wafer Bonding for High-Volume Production

The universal Fully Automatic Wafer Bonding tools allow for aligned wafer bonding of wafer sizes up to 200 mm. Its versatility and modular design offer maximum process flexibility in all permanent bonding tasks. A novel aligned wafer transfer method eliminates the complexity of traditional systems and offers consistent process results with excellent system availability.

 

Typical applications are:

High-volume production of MEMS, LED and 3D Advanced Packaging.