Semi-Automatic Wafer Bonding

PicoTech offers a wide range of Semi-Automatic Wafer Bonding tools by Suss MicroTec for R&D applications.

Semi-Automatic Wafer Bonding tools are designed for a wide range of bonding processes and support substrates with a wafer size of up to 200 mm. All process parameters can be adapted flexibly according to the requirements, which makes the system perfect for use in research and development. In production, the high level of automation and the sophisticated design ensures a high level of process stability.

 

Typical applications are:

Carrier Temporary Bonding, MEMS, Advanced Packaging, 3D integration, LED and other fields.