PicoTech offers a wide range of Production Temporary and Hybrid Wafer Bonding tools by Suss MicroTec for production applications.
Universal Temporary Wafer Bonder for High-Volume Manufacturing
SUSS MicroTec‘s Temporary Wafer Bonding platform represents the next generation of high-volume manufacturing temporary bonder solutions. The 200/300mm wafer bonding platform can be configured for a low cost of ownership and maximum process flexibility.
Hybrid Bonding for Production
The universal Hybrid Wafer Bonding platform is designed for (hybrid) fusion bonding of aligned 200 mm and 300 mm wafers. Its highly modular design offers maximum configuration flexibility at low cost of ownership for customers. Different configurations are available to meet the requirements in both R&D and high-volume manufacturing (HVM) environments. The hybrid bonding platform allows for both collective D2W (die-to-wafer) and W2W (wafer-to-wafer) hybrid bonding focusing on the most demanding applications such as 3D stacked memory or 3D SOC (system-on-chip).
