Vacuum Plasma for Combined Surface Cleaning and RIE Etching

PicoTech offers a wide range of laboratory Vacuum Plasma tools for Combined Surface Cleaning and Reactive Ion Etching (RIE) Processes.

Compact and easy to use, Versatile Vacuum Plasma Systems (Cleaning + RIE etching) are typically table-top and used by universities and small laboratories. Comparing to the standard vacuum plasma tools, these tools can be equipped with optional RIE electrode (3/6/8″) for general purpose isotropic RIE etching with low uniformities.

This allows for user to have an additional opportunity to etch oxides, polyimides and other materials in isotropic manner with reactive ion etching technology (RIE) in gases and gas mixtures, for example: Ar, CF4, SF6, O2.

 

Typical applications are:

General purpose isotropic RIE etching with low uniformity, Surface Cleaning, Surface Activation, Surface Modification, Hydrofobic Coatings, Hydrofilic Coatings and many others.