PicoTech offers a wide range of Fully Automatic and Cluster Tools for RIE, ICP, IBE for High Volume Production and R&D. These Dry Etch tools are suitable for wafer processing from pieces up to 300mm with automatic substrate loading.
Technologies are: Reactive Ion Etching (RIE), Inductively Coupled Plasma (ICP), Ion Beam Etching (IBE).
Modular design of Automatic Cluster Tools allows flexible configuration of substrate handling for a variety of handling options, from R&D single wafer or carrier loading with a load lock to high-volume, multi-chamber production clusters. Clear upgrade paths that leverage costs and process development make future planning easy.
Typical applications are:
Large library of processes for Wireless, Photonics, Power Device, Compound Semiconductor, Memory, Quantum, and Advanced Packaging applications:
- II-VIs and III-Vs: GaAs, InP, GaN, AlN, CdTe, InSb
- Silicon-based: Si, poly-Si, SiC
- Deep Silicon Etch
- Dielectrics: SiO2, SiNx, SiON, quartz, fused silica
- Polymers: PR, PI, BCB
- Metals: Al, Cr, V, W, Mo, Ti, Ta, Nb, Cu, Au, Pt
- Metal oxides and nitrides: TiN, TaN, TiOx, TaOx, HfOx
- Piezoelectrics: LiNbO3, LiTaO3
- Corrosive chemistry processes: HBr, Cl2, BCl3
