PicoTech offers a wide range of Manual and Semi-Automatic Ion Beam Etching and Milling tools for R&D and Pilot Production. These Etch tools are suitable for wafer processing from pieces up to 300mm wafers with manual or automated substrate loading.
Ion Beam Etch (IBE) & Milling technology allows films to be etched or deposited by the use of beams of charged ions in a high vacuum system. For etching (often called ‘milling’), the ion beam is directed at the substrate that is patterned, or blank in some applications, and the bombardment of the substrate is well defined and controlled.
Typical applications are:
R&D in thin films: Data Storage, Spintronics, and Semiconductors.
Nanofabrication: MEMS, Optical, Sensing, Photonic, RF/microwave, Passive Power Components, Biocompatible, Memory Devices.
Reverse Engineering and Failure Analysis.
Different industrial applications.
