PicoTech offers a wide range of Manual Reactive Ion Etching (RIE) tools for or R&D and Low Volume Production. These Etch tools are suitable for wafer processing from pieces up to 200mm with single substrate loading or multiple substrates loading in bigger systems, depending on the model.
The process recipes developed for the Manual Reactive Ion Etching (RIE) tools provide etch solutions for a broad range of markets, including Failure Analysis, Microelectromechanical Systems (MEMS), Optoelectronics, Advanced Packaging, Wireless Devices, and Power Semiconductors.
Typical applications are:
Manually-loaded RIE systems can etch a wide range of materials including Silicon, Silicon-based Compounds, Metals, and Polymers with fluorinated gases.
Load-locked RIE systems provide RIE etching capabilities over a variety of materials including Silicon, Silicon Compounds, Polymers, III-V & II-VI Compound Semiconductors and Metals.
Large reactor systems are suited for etching III-V compounds such as GaAs, GaP, GaN, and AlGaN. as well as etching of chrome and quartz for mask repair applications.
