PicoTech offers a wide range of Photoresist Stripping and Bosch Polymer Removal tools for R&D and Pilot Production. These Dry Etch tools are suitable for single wafer and batch wafer processing from pieces up to 300mm with manual or automated substrate loading.
These tools can use conventional plasma or downstream processing with unique distributed ICP sources which avoids ion-related device damage. Available configurations range from a single chamber with manual loading to cluster system arrangements on a fully automatic robotic wafer handler.
Typical applications are:
• Low temp O2 or F-based processing
• PR stripping
• Bosch polymer removal
• Surface modification
• Stiction-free sacrificial film etching
