PicoTech offers a wide range of Semi-Automatic Reactive Ion Etching (RIE) and Inductively Coupled Plasma (ICP) tools for R&D, Low Volume and Pilot Production. These Dry Etch tools are suitable for wafer processing from pieces up to 200mm with single substrate loading or multiple substrates loading in bigger systems, depending on the model.
The process recipes developed for the Semi-auto Reactive Ion Etching (RIE) and Inductively Coupled Plasma (ICP) tools provide etch solutions for a broad range of markets, including Failure Analysis, Microelectromechanical Systems (MEMS), Optoelectronics, Advanced Packaging, Wireless Devices, and Power Semiconductors.
Typical applications are:
Semi-auto Load-locked RIE and RIE-ICP systems provide etching capabilities over a variety of materials including Silicon, Silicon Compounds, Polymers, III-V & II-VI Compound Semiconductors and Metals.
The equipment uses fluorinated or chlorinated and oxygen-based chemistries to provide excellent etch rates and uniformities across multiple substrate types: Dies, Packaged Dies, and Wafers up to 200 mm.
