PicoTech offers a wide range of Indium Bump Deposition tools for production and R&D.
Indium Solder Bump Deposition Systems are optimized for high throughput production with low maintenance and quick turnaround on parts. From pushing the “go” button to pulling out a finished 200 mm wafer takes less than 90 minutes making it ideal for high-volume markets.
Indium Thin Film Deposition using Physical Vapor Deposition (PVD)
PVD methods provide high-quality, and high-performance thin films compared to other thin film deposition methods such as electroplating. PVD coatings exhibit better adhesion, uniformity, and density, with minimal effect of environmental factors on the composition and other film properties. Moreover, PVD allows for a broader range of materials to be deposited and offers better control over coating thickness, making it suitable for applications requiring precise thickness specifications.
Typical applications are:
High uniformity and high throughput Indium coatings for Indium Solder Bump formation.
