PicoTech offers a wide range of Manual, Semi-Auto and Fully Auto Ion Beam Etch (IBE) and Ion Beam Deposition (IBD) tools for R&D and manufacturing.
These Ion Beam Etch (IBE) and Ion Beam Deposition (IBD) tools are suitable for wafer processing from pieces up to 300mm with single substrate loading or multiple substrates loading in bigger systems, depending on the model. Systems can operate in high vacuum or ultra-high vacuum environment. Automated wafer loading options are available for these systems.
Typical applications are:
Research and development of thin film applications such as Data Storage, Spintronics, and Semiconductors.
Repeatably remove diverse materials which are designed into these innovative MEMS, optical, sensing, photonic, RF/microwave, passive power components, biocompatible, and memory devices.
With Ion Beam Assisted PVD, the versatile technology sputters at low pressure metals & dielectrics without powered cathodes. It produces coatings with high density, low particles, smooth and stable material properties.
Failure Analysis and Devices Decapsulation by IBE with SIMS.
