PicoTech offers a wide range of Semi-Automatic Physical Vapor Deposition (PVD) tools for R&D and small production: Thermal, Sputter, E-beam, Ion Beam Deposition (IBD), Ion Beam Sputtering (IBS), Plasma Assisted Reactive Magnetron Sputtering (PARMS), Organic Materials Evaporation. Several different technologies can be combined in a single chamber to fit almost any R&D and small production needs.
These physical vapor deposition tools are suitable for wafer processing from pieces up to 200mm wafers with single substrate loading or multiple substrates loading in bigger systems, depending on the model. Systems can operate in high vacuum or ultra-high vacuum environment. Automated or Load-Locked wafer loading options are available for these systems.
Typical applications are:
Physical Vapor Deposition (PVD) of materials in R&D and pilot production. Thin film deposition, thin film coating development and manufacturing, including Semiconductors, Optical Coatings, Batteries, Biomedical and many others.
For example: Metal Contacts, E-Beam evaporation for lift-off, Optical Interference Filters, Multi-Layer Barrier Coatings, and Transparent Conductive Oxides (TCOs).
