PicoTech offers a wide range of Plasma Enhanced ALD (PEALD) Systems for R&D.
Plasma Enhanced ALD (PEALD) on top of the benefits of thermal ALD, allows a wider process window and enhanced process (films) quality:
-Low-temperature ALD process and low plasma damage
-Reduced purge times between ALD cycles
-Higher quality films with higher densities
-Ability to control stoichiometry
A variety of materials is possible with conventional Thermal ALD:
Oxides
Al2O3, HfO2, SiO2, TiO2, SrTiO3, Ta2O5, Gd2O3, ZrO2, Ga2O3, V2O5, Co3O4, ZnO, ZnO:Al, ZnO:B, In2O3:H, WO3, MoO3, Nb2O5, NiO, MgO, RuO2
Nitrides
TiN, TaN, Si3N4, AlN, GaN, WN, HfN, NbN, GdN, VN, ZrN
Metals
Pt, Ru, Pd, Ni, W
Fluorides
MgF2, AlF3
Organic Materials
Alucone
Sulfides
ZnS, MoS2
