PicoTech offers a wide range of Manual and Batch Vacuum Plasma Ashers for Photoresist Removal.
Manual and Batch Vacuum Plasma Ashers utilize different technologies, from conventional RF and microwave plasma to High-Density Radical Flux (HDRF) technology which produces high concentrations of reactive radicals, without charged particles or unwanted photons. This chemical (non-physical), non-damaging plasma is ideal for conventional and low-temperature applications.
Typical applications are:
General purpose Photoresist Removal and Photoresist Strip, Low-temperature (50˚C to 150˚C) Photoresist Removal, High-rate (150˚C to 250˚C) Photoresist Removal, Surface Organic Cleaning, Sacrificial polymer release for MEMS devices.
