PicoTech offers a wide range of Manual Plasma Enhanced Chemical Vapor Deposition (PECVD) tools for or R&D and Low Volume Production. These Deposition tools are suitable for wafer processing from pieces up to 200mm with single substrate loading or multiple substrates loading in bigger systems, depending on the model.
The process recipes developed for the Manual Plasma Enhanced Chemical Vapor Deposition (PECVD) tools provide deposition solutions for a broad range of markets, including Failure Analysis, Microelectromechanical Systems (MEMS), Optoelectronics, Advanced Packaging, Wireless Devices, and Power Semiconductors.
Typical applications are:
Manually-loaded PECVD systems are suitable for a wide range of materials including SiO2, Si3N4, SiOCH, SiOF, SiC and aSi-H films.
ICP-PECVD systems are capable of depositing high-quality SiO2, Si3N4, SiOCH, SiOF, SiC, and aSi-H films at low temperatures.
