Film Assisted Molding Technology Packaging

PicoTech offers Film Assisted Molding Technology tools by Boschman for Advanced Packaging.

Film Assisted Molding Technology

Film Assisted Molding (FAM) is a variation on the transfer molding process. It uses one or two films in the mold, which are sucked down onto its inner surface before products are being loaded. It enables us to produce very specific package designs that couldn’t be made otherwise. Especially the possibility to create packages with very small areas or very large exposed areas in a stable and robust process, offers a lot of interesting opportunities in MEMS, Sensors, medical, optical and power devices.

Main advantages Film Assisted Molding

• Enables the possibility to create open packages by using inserts in top and/or bottom mold
• Enables high density applications, with small unit interspacing, at high yield
• No mold cleaning required, which reduces operational costs and results in significant higher production efficiency.
• Enables lower clamping forces, minimizing lead frame or substrate deformation and stress.
• Reduces the need for de-flash processing (Depending on the application)
• The use of a large variety of molding compounds, including very sticky types and liquid silicone materials.
• Extremely long lifetime of mold parts while film functions as a soft cushion.
• Possibility of using sensor thickness down to 200 micron, without having bleed and/or crack defects
Boschman offers two categories of Film Assisted transfer Molding (FAM) solutions: for R&D, prototyping and low volume production we offer the Semi-automatic, Unistar -Innovate series. And for efficient, high quality medium to high volume production the Unistar -Auto series are the best choice.